The HEP8225 HDEC Series System Host Board (SHB) and backplanes build upon the basic features of the PICMG® 1.3 specification to provide expanded support for industry standard PCI Express plug-in cards. The HEP8225 HDEC Series system host board utilizes the latest high-density PCI Express interconnect technology to deliver eighty (80) PCI Express 3.0 lanes to the HDEC Series® backplane providing an impressive data throughput increase of 300% of over a standard PICMG 1.3 SHB.

The HEP8225 HDEC Series SHB is built on the Intel® C226 platform controller hub to provide support for the latest Intel® Xeon® E5-2600 v3 series processors. Two Xeon processors with up to 14 cores each can be installed with up to 8 16GB DDR4 DIMMs to provide a maximum of 128GB of memory.

In addition the HEP8225 HDEC Series SHB features native 10Gbit and 1Gbit Ethernet ports, 8 SATA/600 ports, 6 USB3.0 ports, 4 USB2.0 ports, audio I/O and on-board 1920x1080 VGA graphics.

When installed on the HDB8228 HDEC backplane the HEP8225 provides 4 PCI Express [x16] slots and 4 PCI Express [x4] slots. The HEP8225 HDEC Series system host board and HDEC backplanes delivers enhanced mechanical attributes that are ideal for rugged application environments, enable more SHB I/O features to be routed to the system backplane and are easily integrated into existing industry standard rack mount computer chassis.

Designed in the USA for extended long-life system deployments, the HEP8225 HDEC Series provides a growth path for future system performance enhancements.


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